SMT
SVTronics possesses the best SMT machines in the industry, as well as the SMT expertise and know-how to understand the process, the material property, the board design, and the system reliability. We have acquired substantial expertise in engineering design, advanced manufacturing techniques and processes, products testing, and technology management.
These technologies include PTH, SMT, fine pitch, paste-in-hole, BGA, chip scale packaging (CSP), flip chips, and reliability & stress testing. In particular, our engineers have acquired the expertise to do plastics and ceramic Ball Grid Array (BGA), as well as Chip Size Packaging (CSP). We have also completed our development work for flip chips in areas such as GGI, ACF, SBB, and Euthetic balls.
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SURFACE MOUNT TECHNOLOGY (SMT) Fine Pitch SMT of High-Speed Machines
Fine Pitch SMT of Rigid-PCBs or FLEX-PCBs
Smallest Chip Component --> 0402
Finest Pitch QFP -- 12 mil pitch
Maximum Board Size -- 20" x 18"
Minimum Board Size -- 0.5" x 1.5"
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BGA & MicroBGA capability with:
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Real Time X-Ray inspection for Solder Joint
BGA Rework Station with Re-Ball capability
Laser Section Microscope for solder paste applications |